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LDLL16ENTR Datasheet(PDF) 92 Page - STMicroelectronics |
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LDLL16ENTR Datasheet(HTML) 92 Page - STMicroelectronics |
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92 / 102 page ![]() 8 Package and PCB thermal data 8.1 QFN32L thermal data Figure 41. QFN32L on four-layers PCB Top layer: 95% of the area Bottom layer: 95% of the area Cu on mid1 layer: 1% of the area Cu on mid2 layer: 1% of the area Table 71. PCB properties Dimension Value Board finish thickness 1.6 mm ±10% Board dimension 129 mm x 60 mm Board material FR4 Copper thickness (outer layers) 0.070 mm Copper thickness (inner layers) 0.035 mm Thermal vias separation 1.2 mm Thermal via diameter 0.3 mm ±0.08 mm Copper thickness on vias 0.025 mm LDLL16EN Package and PCB thermal data DS14111 - Rev 5 page 92/102 |
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