LDLL16ENTR datasheet(6/102 Pages) STMICROELECTRONICS

6 / 102 page

Figure 4. QFN32L 5x5 connection diagram

Exposed pad

RDAC

FAULT

NTC

OUT13

OUT12

OUT11

SYNC_IO

DIN

V_IO

OUT10

OUT9

OUT8

OUT7

OUT6

OUT5

OUT4

OUT3

GND

STB

OUT0

OUT1

OUT2

OUT14

OUT15

VPREG

TEST1

TEST

V3V3

Table 1. Pin list description

Pin #

Name

Type I/O

Description

1-4, 21-24,

25-32

OUTx

x = 0-15

Output pin, up to 16 channels – low-side configuration.

GND

I/O

Ground connection.

SYNC_IO

I/O

Synchronization input/output pin – for PWM synchronization among several devices. Left

floating when not used. It is suggested to connect a shared 1kΩ resistor in series as

protection when 2 or more devices are synchronized (therefore in the event that, by

mistake, two or more devices are both configured as master).

V3V3

I/O

3.3 V regulator output voltage (logic and I/O). Connect a low ESR capacitor (1 µF) close

to this pin.

V_IO

I/O

I/O pin receiving external CAN transceiver supply regulator’s output voltage (to manage

TX and STB pins).

Chip select input – for entering test and programming mode.

Input supply pin ofthe IC. Connect VS to the car battery voltage. Must be reverse

protected (external diode). Input supply for the 3.3 V internal linear voltage regulator.

Receive CAN FD light compatible data. Input.

Transmit CAN FD light compatible data output. It is suggested to use 2 kΩ pull-up

resistor.

FAULT

I/O

I/O pin for diagnostic (1 fault pin used for diagnostic)

RDAC

External resistor for DACs current reference It is suggested to use E96 series, 61.9 kΩ

(1% tolerance standard thin film resistance, ±0.7%, 100 ppm/K, temperature spread in the

range [-40÷100]°C).

15, 18

TESTx

Internal use only. To be connected to GND.

NTC

NTC pin for LEDs thermal control. Connect an external NTC resistor.

STB

CAN (external) transceiver standby mode control output. It is suggested to use 10 kΩ.

DIN

Direct input pin.

VPREG

1 pin for connection to external pre-regulator (to beconnected to the anode of LED

strings).

Exposed (thermal) pad-connected to PCB ground, for thermal dissipation.

LDLL16EN

Introduction

DS14111 - Rev 5

page 6/102

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