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XC888LM Datasheet(PDF) 140 Page - Infineon Technologies AG

Part # XC888LM
Description  8-Bit Single-Chip Microcontroller
PDF  144 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

XC888LM Datasheet(HTML) 140 Page - Infineon Technologies AG

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XC886/888CLM
Package and Quality Declaration
Data Sheet
133
V0.9, 2006-12
5
Package and Quality Declaration
Chapter 5 provides the information of the XC886/888 package and reliability section.
5.1
Package Parameters
Table 1 provides the thermal characteristics of the package used in XC886 and XC888.
Table 1
Thermal Characteristics of the Packages
Parameter
Symbol
Limit Values
Unit
Notes
Min.
Max.
PG-TQFP-48 (XC886)
Thermal resistance junction
case
1)
1) The thermal resistances between the case and the ambient (
R
TCA) , the lead and the ambient (RTLA) are to be
combined with the thermal resistances between the junction and the case (
R
TJC), the junction and the lead
(
R
TJL) given above, in order to calculate the total thermal resistance between the junction and the ambient
(
R
TJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation:
T
J=TA+RTJA × PD, where the RTJA is
the total thermal resistance between the junction and the ambient. This total junction ambient resistance
R
TJA
can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
R
TJC
CC -
13
K/W
-
Thermal resistance junction
lead
1)
R
TJL
CC -
32.5
K/W
-
PG-TQFP-64 (XC888)
Thermal resistance junction
case
1)
R
TJC
CC -
12.6
K/W
-
Thermal resistance junction
lead
1)
R
TJL
CC -
33.4
K/W
-



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