CY8C3865LTI-059 datasheet(119/129 Pages) CYPRESS

119 / 129 page

PSoC® 3: CY8C38 Family

Data Sheet

Document Number: 001-11729 Rev. *R

Page 119 of 129

13. Packaging

Table 13-1. Package Characteristics

Parameter

Description

Conditions

Min

Typ

Max

Units

Operating ambient temperature

–40

25.00

°C

Operating junction temperature

–40

–

100

°C

Tja

Package

θJA (48-pin SSOP)

–

45.16

–

°C/Watt

Tja

Package

θJA (48-pin QFN)

–

15.94

–

°C/Watt

Tja

Package

θJA (68-pin QFN)

–

11.72

–

°C/Watt

Tja

Package

θJA (100-pin TQFP)

–

30.52

–

°C/Watt

Tjc

Package

θJC (48-pin SSOP)

–

27.84

–

°C/Watt

Tjc

Package

θJC (48-pin QFN)

–

7.05

–

°C/Watt

Tjc

Package

θJC (68-pin QFN)

–

6.32

–

°C/Watt

Tjc

Package

θJC (100-pin TQFP)

–

9.04

–

°C/Watt

Table 13-2. Solder Reflow Peak Temperature

Package

Maximum Peak

Temperature

Maximum Time at Peak

Temperature

48-pin SSOP

260 °C

30 seconds

48-pin QFN

260 °C

30 seconds

68-pin QFN

260 °C

30 seconds

100-pin TQFP

260 °C

30 seconds

Table 13-3. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2

Package

MSL

48-pin SSOP

MSL 3

48-pin QFN

MSL 3

68-pin QFN

MSL 3

100-pin TQFP

MSL 3

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