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34708 Datasheet(PDF) 15 Page - Freescale Semiconductor, Inc

Part # 34708
Description  Power Management Integrated Circuit (PMIC) for i.MX50/53 Families
PDF  159 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

34708 Datasheet(HTML) 15 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
15
Freescale Semiconductor
MC34708
General Product Characteristics
RθJMA
Junction to Ambient (@200 ft/min.)
• Single layer board (1s)
-
48
°C/W
(6), (8)
RθJMA
Junction to Ambient (@200 ft/min.)
• Four layer board (2s2p)
-
32
°C/W
(6), (8)
RθJB
Junction to Board
-
22
°C/W
(9)
RθJC
Junction to Case
-
15
°C/W
(10)
θJT
Junction to Package Top
• Natural Convection
-
3.0
°C/W
(11)
Notes
4.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause a malfunction or permanent damage to the device.
5.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
6.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
7.
Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
8.
Per JEDEC JESD51-6 with the board horizontal.
9.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
10.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
11.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per
JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 5. Thermal Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol
Description (Rating)
Min.
Max.
Unit
Notes



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