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STM32H562II Datasheet(PDF) 265 Page - STMicroelectronics |
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STM32H562II Datasheet(HTML) 265 Page - STMicroelectronics |
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265 / 270 page  DS14258 Rev 5 265/270 STM32H562xx and STM32H563xx Package information 265 6.10.1 Reference documents • JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. • For information on thermal management, refer to AN5036 “Guidelines for thermal management on STM32 applications”, available from www.st.com. ΘJC Thermal resistance junction-case LQFP64 (10 x 10 mm) 10.3 °C/W VFQFPN68 (8 x 8 mm) 10.8 WLCSP80 (3.50 x 3.27 mm) 2.3 LQFP100 (14 x 14 mm) 8.5 LQFP144 (20 x 20 mm) 8.6 LQFP176 (24 x 24 mm) 9.1 UFBGA169 (7 x 7 mm) 11.2 UFBGA176 (10 x 10 mm) 10.9 Table 140. Package thermal characteristics (continued) Symbol Definition Parameter Value Unit |
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