STM32H562II datasheet(264/270 Pages) STMICROELECTRONICS

264 / 270 page

Package information

STM32H562xx and STM32H563xx

264/270

DS14258 Rev 5

6.10

Package thermal characteristics

The maximum chip-junction temperature, TJmax in degrees Celsius, can be calculated using

the following equation:

TJmax = TAmax + (PDmax × ΘJA)

Where:

•

TAmax is the maximum ambient temperature in °C,

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

•

PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax),

•

PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/Omax represents the maximum power dissipation on output pins:

PI/Omax = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 140. Package thermal characteristics

Symbol

Definition

Parameter

Value

Unit

ΘJA

Thermal resistance

junction-ambient

LQFP64 (10 x 10 mm)

48.1

°C/W

VFQFPN68 (8 x 8 mm)

24.2

WLCSP80 (3.50 x 3.27 mm)

47.3

LQFP100 (14 x 14 mm)

35.9

LQFP144 (20 x 20 mm)

37.5

LQFP176 (24 x 24 mm)

38.3

UFBGA169 (7 x 7 mm)

40.6

UFBGA176 (10 x 10 mm)

39.1

ΘJB

Thermal resistance

junction-board

LQFP64 (10 x 10 mm)

24.1

°C/W

VFQFPN68 (8 x 8 mm)

9.4

WLCSP80 (3.50 x 3.27 mm)

23.0

LQFP100 (14 x 14 mm)

21.9

LQFP144 (20 x 20 mm)

26.3

LQFP176 (24 x 24 mm)

28.3

UFBGA169 (7 x 7 mm)

26.4

UFBGA176 (10 x 10 mm)

27.0

STM32H562II Datasheet(PDF) 264 Page - STMicroelectronics

STM32H562II Datasheet(HTML) 264 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL