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STM32H562II Datasheet(PDF) 256 Page - STMicroelectronics

Part # STM32H562II
Description  Arm® Cortex®-M33 32-bit MCU TrustZone® FPU, 375 DMIPS, 250 MHz, 2-Mbyte flash, 640-Kbyte RAM, math accelerators
PDF  270 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H562II Datasheet(HTML) 256 Page - STMicroelectronics

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DS14258 Rev 5
Table 135. UFBGA169 - Mechanical data
Symbol
millimeters
inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min.
Typ.
Max.
Min.
Typ.
Max.
A(2)
2. The profile height, A, is the distance from the seating plane to the highest point on the package. It is
measured perpendicular to the seating plane.
-
-
0.60
-
-
0.0236
A1(3)
3. A1 is defined as the distance from the seating plane to the lowest point on the package body.
0.05
-
-
0.0020
-
-
A2
-
0.43
-
-
0.0169
-
b(4)
4. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to primary
datum C.
0.23
0.28
0.33
0.0091
0.0110
0.0130
D(5)
5. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance. For
tolerances refer to form and position table.
7.00 BSC
0.2756 BSC
D1(5)
6.00 BSC
0.2362 BSC
E(5)
7.00 BSC
0.2756 BSC
E1(5)
6.00 BSC
0.2362 BSC
e(5)(6)
6. e represents the solder ball grid pitch.
0.50 BSC
0.0197 BSC
N(7)
7. N represents the total number of balls on the BGA.
169
SD(5)(8)
8. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the position of the
centre ball(s) in the outer row or column of a fully populated matrix.
0.50 BSC
0.0197 BSC
SE(5)(8)
0.50 BSC
0.0197 BSC
aaa(9)
9. Tolerance of form and position drawing
0.15
0.0059
ccc(9)
0.20
0.0079
ddd(9)
0.08
0.0031
eee(9)
0.15
0.0059
fff(9)
0.05
0.0020



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