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STM32H562II Datasheet(PDF) 255 Page - STMicroelectronics

Part # STM32H562II
Description  Arm® Cortex®-M33 32-bit MCU TrustZone® FPU, 375 DMIPS, 250 MHz, 2-Mbyte flash, 640-Kbyte RAM, math accelerators
PDF  270 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H562II Datasheet(HTML) 255 Page - STMicroelectronics

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DS14258 Rev 5
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STM32H562xx and STM32H563xx
Package information
265
6.7
UFBGA169 package information (A0YV)
This UFBGA is a 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package.
Figure 90. UFBGA169 - Outline
1. Drawing is not to scale.
2. Primary datum C is defined by the plane established by the contact points of three or more solder balls that
support the device when it is placed on top of a planar surface.
3. The terminal (ball) A1 corner must be identified on the top surface of the package by using a corner
chamfer, ink or metallized markings, or other feature of package body or integral heat slug. A distinguish
feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of
each corner is optional.
A0YV_UFBGA169_ME_V2
E
TOP VIEW
A1 ball pad
corner
A
SIDE VIEW
Detail A
C
e
N
BOTTOM VIEW
Ø
b (169 balls)
B
eee
Ø
M
fff
Ø
M
C
C
A
D1
E1
1
SE
e
23
13
456 789 10 11 12
A1 ball pad
corner
M
L
K
J
H
G
F
E
D
C
B
A
SD
B
A
D
aaa C
(4x)
Seating plane
A1
A3
C
ddd
Substrate
Solder balls
A5
A2
Mold resin
C
ccc
2
(DATUM B)
(DATUM A)
3
DETAIL A
C



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