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STM32H562II Datasheet(PDF) 247 Page - STMicroelectronics |
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STM32H562II Datasheet(HTML) 247 Page - STMicroelectronics |
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247 / 270 page  DS14258 Rev 5 247/270 STM32H562xx and STM32H563xx Package information 265 Figure 84. WLCSP80 - Footprint example Example of device marking for WLCSP80 The following figure gives an example of the locations and orientation of the marking areas versus ball A1, and allows engineering samples to be identified. With the device text markings oriented as in the figure, ball A1 is always located at top left. Figure 85. WLCSP80 marking example (package top view) Table 132. WLCSP80 - Example of PCB design rules Dimension Values Pitch 0.35 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.235 mm Stencil thickness 0.080 mm BGA_WLCSP_FT_V1 Dsm Dpad MS56506V1 Product identification Date code Ball 1 identifier Yww Revision code |
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