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STM32H562II Datasheet(PDF) 245 Page - STMicroelectronics

Part # STM32H562II
Description  Arm® Cortex®-M33 32-bit MCU TrustZone® FPU, 375 DMIPS, 250 MHz, 2-Mbyte flash, 640-Kbyte RAM, math accelerators
PDF  270 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H562II Datasheet(HTML) 245 Page - STMicroelectronics

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DS14258 Rev 5
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STM32H562xx and STM32H563xx
Package information
265
6.4
WLCSP80 package information (B0D4)
This WLCSP is a 80 ball, 3.50 x 3.27 mm, 0.35 mm pitch, wafer level chip scale package.
Figure 83. WLCSP80 - Outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010. The tolerance of position that controls the location of
the pattern of balls with respect to datums X and Y. For each ball there is a cylindrical tolerance zone ccc
perpendicular to datum Z and located on true position with respect to datums X and Y as defined by e. The
axis perpendicular to datum Z of each ball must lie within this tolerance zone.
G
F
e2
e1
BOTTOM VIEW
K
e
e
e
(DETAIL B)
DETAIL B
SIDE VIEW
A3
A2
SIDE VIEW
(DETAIL A)
A
DETAIL A
BUMP
eee Z
A1
ccc
ddd
Z
Z
XY
b (80x)
DETAIL A
ROTATED 90
SEATING
PLANE
D
E
aaa C
4x
TOP VIEW
A1 Orientation
ref
B0D4_WLCSP80_ME_V1



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