DFE252012F-R47M datasheet(7/122 Pages) AD

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Absolute Maximum Ratings

SYS to AGND ...................................................... -0.3V to +17.6V

ALT_IN to AGND ................................................... -0.3V to +6.0V

VDD to AGND ........................................................ -0.3V to +2.2V

VL12, VL34 to AGND, PGND ................................. -0.3V to +2.2V

CE to AGND ........................... -0.3V to min (VSYS + 0.3, +17.6)V

CFGx to AGND........................... -0.3V to min (VDD + 0.3, +2.2)V

SELx to AGND ........................... -0.3V to min (VDD + 0.3, +2.2)V

INx to PGNDx, AGND.......................................... -0.3V to +17.6V

LXx to PGNDx ..................................................... -0.3V to +17.6V

LXx to PGNDx (less than 10ns) .................... (VIN - 22)V to +22V

BSTx to LXx .......................................................... -0.3V to +2.2V

SNSxP to AGND ................................................. -0.3V to +12.0V

SNSxN to AGND.................................................... -0.3V to +0.3V

PGNDx to AGND ................................................... -0.3V to +0.3V

VIO to AGND.......................................................... -0.3V to +2.2V

SCL to AGND......................................................... -0.3V to +2.2V

SDA to AGND ........................................................ -0.3V to +2.2V

IRQB to AGND....................................................... -0.3V to +2.2V

MFIOx to AGND...........................-0.3V to min (VIO + 0.3, +2.2)V

Continuous Power Dissipation (JESD51-7, TA = +70ºC)

60 WLP (derate 25.4mW/°C above +70°C).................2037mW

Junction Temperature ....................................................... +150°C

Storage Temperature Range ..............................-65°C to +150°C

Soldering Temperature (reflow) ........................................+260°C

Note 1: LXx has internal clamp diodes to its corresponding PGNDx and INx. Applications that forward bias these diodes should take

care not to exceed the IC's package power dissipation limits.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Recommended Operating Conditions

PARAMETER

SYMBOL

CONDITION

TYPICAL

RANGE

UNIT

Input Voltage Range

VIN

2.8 to 16

Output Current Range

IOUT

For continuous operation at 4A, the junction

temperature (TJ) is limited to +120ºC; if the

junction temperature is higher than +120ºC, the

expected lifetime at 4A continuous operation is

derated

0 to 4

Junction Temperature Range

-40 to

+125

ºC

Note: These limits are not guaranteed.

Package Information

60 WLP (Thick UBM)

Packkage Code

W602A4Z+1

Outline Number

21-100610

Land Pattern Number

Application Note 1891

Thermal Resistance, Four-Layer Board:

Junction-to-Ambient (θJA)

39.27°C/W

MAX77542

16VIN/16A, Quad-Phase High-Efficiency Buck

Converter

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