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MAX1111EEE Datasheet(PDF) 16 Page - Maxim Integrated Products |
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MAX1111EEE Datasheet(HTML) 16 Page - Maxim Integrated Products |
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16 / 20 page ![]() Applications Information Power-On Reset When power is first applied, and if SHDN is not pulled low, internal power-on reset circuitry activates the MAX1110/MAX1111 in internal clock mode. SSTRB is high on power-up and, if CS is low, the first logical 1 on DIN is interpreted as a start bit. Until a conversion takes place, DOUT shifts out zeros. No conversions should be performed until the reference voltage has stabilized (see Electrical Characteristics). Power-Down When operating at speeds below the maximum sam- pling rate, the MAX1110/MAX1111’s automatic power- down mode can save considerable power by placing the converters in a low-current shutdown state between conversions. Figure 13 shows the average supply cur- rent as a function of the sampling rate. Select power-down with PD1 of the DIN control byte with SHDN high or floating (Table 3). Pull SHDN low at any time to shut down the converters completely. SHDN overrides PD1 of the control byte. Figures 14a and 14b illustrate the various power-down sequences in both external and internal clock modes. Software Power-Down Software power-down is activated using bit PD1 of the control byte. When software power-down is asserted, the ADCs continue to operate in the last specified clock mode until the conversion is complete. The ADCs then power down into a low quiescent-current state. In internal clock mode, the interface remains active, and conversion results may be clocked out after the MAX1110/ MAX1111 have entered a software power-down. The first logical 1 on DIN is interpreted as a start bit, which powers up the MAX1110/MAX1111. If the DIN byte contains PD1 = 1, then the chip remains powered up. If PD1 = 0, power-down resumes after one conversion. Hard-Wired Power-Down Pulling SHDN low places the converters in hard-wired power-down. Unlike software power-down, the conver- sion is not completed; it stops coincidentally with SHDN being brought low. SHDN also controls the state of the internal reference (Table 5). Letting SHDN float enables the internal 2.048V voltage reference. When returning to normal operation with SHDN floating, there is a tRC delay of approximately 1M Ω x CLOAD, where CLOAD is the capacitive loading on the SHDN pin. Pulling SHDN high disables the internal reference, which saves power when using an external reference. External Reference An external reference between 1V and VDD should be connected directly at the REFIN terminal. The DC input impedance at REFIN is extremely high, consisting of leakage current only (typically 10nA). During a conver- sion, the reference must be able to deliver up to 20µA average load current and have an output impedance of 1k Ω or less at the conversion clock frequency. If the reference has higher output impedance or is noisy, bypass it close to the REFIN pin with a 0.1µF capacitor. If an external reference is used with the MAX1110/ MAX1111, tie SHDN to VDD to disable the internal refer- ence and decrease power consumption. +2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs 16 ______________________________________________________________________________________ Table 5. Hard-Wired Power-Down and Internal Reference State SHDN STATE DEVICE MODE 1 Enabled Floating Enabled 0 Power-Down INTERNAL REFERENCE Disabled Disabled Enabled 1000 1 010 30 50 10 100 SAMPLING RATE (ksps) 20 40 VDD = VREFIN = 3V CLOAD AT DOUT AND SSTRB CLOAD = 30pF CODE = 11111111 CLOAD = 30pF CODE = 10101010 CLOAD = 60pF CODE = 10101010 Figure 13. Average Supply Current vs. Sampling Rate |
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