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LTKB Datasheet(PDF) 11 Page - Linear Technology

Part # LTKB
Description  Ultralow Power, Dual 10-Bit DAC in MSOP
PDF  12 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTKB Datasheet(HTML) 11 Page - Linear Technology

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11
LTC1662
2
0.1
µF
Li-Ion BATTERY INPUT
VIN ≥ 4.3V
LTC1258-4.1
1
4.096V
4
REF
SDI
SCK
CS/LD
VOUT A
GND
VCC
LTC1662
VOUT B
0V TO 4.096V
(4mV/BIT)
0V TO 4.096V
(4mV/BIT)
1662 F03
4
3
2
1
8
5
7
6
0.1
µF
PACKAGE DESCRIPTIO
Dimensions in inches (millimeters) unless otherwise noted.
MS8 Package
8-Lead Plastic MSOP
(LTC DWG # 05-08-1660)
MSOP (MS8) 1098
* DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
0.021
± 0.006
(0.53
± 0.015)
0
° – 6° TYP
SEATING
PLANE
0.007
(0.18)
0.040
± 0.006
(1.02
± 0.15)
0.012
(0.30)
REF
0.006
± 0.004
(0.15
± 0.102)
0.034
± 0.004
(0.86
± 0.102)
0.0256
(0.65)
BSC
12
3
4
0.193
± 0.006
(4.90
± 0.15)
8
7 6
5
0.118
± 0.004*
(3.00
± 0.102)
0.118
± 0.004**
(3.00
± 0.102)
N8 Package
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
N8 1098
0.100
(2.54)
BSC
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.130
± 0.005
(3.302
± 0.127)
0.020
(0.508)
MIN
0.018
± 0.003
(0.457
± 0.076)
0.125
(3.175)
MIN
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325
+0.035
–0.015
+0.889
–0.381
8.255
()
12
3
4
87
6
5
0.255
± 0.015*
(6.477
± 0.381)
0.400*
(10.160)
MAX
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
TYPICAL APPLICATIO S
Using the LTC1258 and the LTC1662 In a Portable Application
Powered by a Single Li-Ion Battery. Total Supply Current Is 8.2
µA
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.



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