4

LMT01-SP

SNIS205 – JANUARY 2019

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating temperature range (unless otherwise noted)

MIN

MAX

UNIT

Voltage drop (VP – VN)

−0.3

6

V

−65

175

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±750

(1)

During transmission of pulses at a high level.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Free-air temperature

−55

125

°C

Voltage drop (VP – VN)

5.5

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

LMT01-SP

UNIT

HTA (CTO-92)

2 PINS

Junction-to-ambient thermal resistance

124.7

°C/W

Junction-to-case (top) thermal resistance

51.8

°C/W

Junction-to-board thermal resistance

64.8

°C/W

Junction-to-top characterization parameter

3.8

°C/W

Junction-to-board characterization parameter

63.6

°C/W