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14

LMT01-SP

SNIS205 – JANUARY 2019

www.ti.com

Product Folder Links: LMT01-SP

Submit Documentation Feedback

Copyright © 2019, Texas Instruments Incorporated

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Mounting, Temperature Conductivity, and Self-Heating

The LMT01-SP can be applied easily in the same way as other integrated-circuit temperature sensors. It can be

glued or cemented to a surface to ensure good temperature conductivity. The temperatures of the lands and

traces to the leads of the LMT01-SP also affect the temperature reading, so they must be a thin as possible.

The LMT01-SP comes in a hermetically sealed ceramic package and as such the IC is not susceptible to

moisture or corrosion. Accompanying wiring and circuits should be kept insulated and dry to avoid excessive

leakage and corrosion. Printed-circuit coatings are often used to ensure that moisture cannot corrode the leads

or circuit traces.

The junction temperature of the LMT01-SP is the actual temperature being measured by the device. The thermal

device junction temperature (self-heating) due to its average power dissipation. The average power dissipation of

the LMT01-SP is dependent on the temperature it is transmitting as it effects the output pulse count and the

voltage across the device. Equation 4 is used to calculate the self-heating in the die temperature of the LMT01-

where

•

•

•

•

•

•

•

PC is the output pulse count

•

(4)

Plotted in the curve Figure 24 are the typical average supply current (black line using left y-axis) and the resulting

self-heating (red and violet lines using right y-axis) during continuous conversions. A temperature range of –50°C

seen in the curve, the average power supply current and thus the average self-heating changes linearly over

temperature because the number of pulses increases with temperature. A negligible self-heating of about 45 m°C

is observed at 150°C with continuous conversions. If temperature readings are not required as frequently as

every 100 ms, self-heating can be minimized by shutting down power to the part periodically thus lowering the

average power dissipation.