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ADP5585ACPZ-00-R7 Datasheet(PDF) 5 Page - Analog Devices |
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ADP5585ACPZ-00-R7 Datasheet(HTML) 5 Page - Analog Devices |
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5 / 40 page  Data Sheet ADP5585 Rev. C | Page 5 of 40 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VDD to GND −0.3 V to +4 V SCL, SDA, RST, INT, R0, R1, R2, R3, R4, C0, C1, C2, C3, C4 to GND −0.3 V to (VDD + 0.3 V) Temperature Range Operating (Ambient) −40°C to +85°C1 Operating (Junction) −40°C to +125°C Storage −65°C to +150°C 1 In applications where high power dissipation and poor thermal resistance are present, the maximum ambient temperature may need to be derated. Maximum ambient temperature (TA(MAX)) is dependent on the maximum operating junction temperature (TJ (MAXOP) = 125°C), the maximum power dissipation of the device (PD(MAX)), and the junction-to-ambient thermal resistance of the device/package in the application (θJA), using the following equation: TA (MAX) = TJ (MAXOP) − (θJA × PD (MAX)). Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to GND. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a printed circuit board (PCB) for surface-mount packages. Table 3. Thermal Resistance θJA Unit 16-Ball WLCSP 62 °C/W Maximum Power Dissipation 70 mW 16-Lead LFCSP 67.154 °C/W Maximum Power Dissipation 70 mW ESD CAUTION |
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