CC1150-RTY1 datasheet(56/67 Pages) TI1

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CC1150

SWRS037B – JANUARY 2006 – REVISED MARCH 2015

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Each decoupling capacitor ground pad should be connected to the ground plane by separate vias. Direct

connections between neighboring power pins will increase noise coupling and should be avoided unless

absolutely necessary. Routing in the ground plane underneath and between the chip, the balun/RF

matching circuit and the decoupling capacitor’s ground vias should also be avoided. This improves the

grounding and ensures the shortest possible return path for stray currents.

The external components should ideally be as small as possible (0402 is recommended) and surface

mount devices are highly recommended. Please note that components smaller than those specified may

have differing characteristics.

Precaution should be used when placing the microcontroller in order to avoid noise interfering with the RF

circuitry.

It is strongly advised that the CC1150EM reference design (see [1] and [2]) layout is followed very closely

in order to get the best performance. Gerber files and schematics for the reference designs are available

for download from the TI website.

Circles are Vias

Figure 6-4. Left: Top Solder Resist Mask (Negative) and Right: Top Paste Mask

Applications, Implementation, and Layout

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CC1150-RTY1 Datasheet(PDF) 56 Page - Texas Instruments