SA56004GD datasheet(32/36 Pages) NXP

32 / 36 page

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

32 of 36

NXP Semiconductors

SA56004X

Digital temperature sensor with overtemperature alarms

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 24.

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”.

15. Mounting

15.1 Printed-circuit board layout considerations

Care must be taken in Printed-Circuit Board (PCB) layout to minimize noise induced at the

remote temperature sensor inputs, especially in extremely noisy environments, such as a

computer motherboard. Noise induced in the traces running between the device sensor

inputs and the remote diode can cause temperature conversion errors. Typical sensor

signal levels to the SA56004X is a few microvolts. The following guidelines are

recommended:

1. Place the SA56004X as close as possible to the remote sensor. It can be from

4 inches to 8 inches, as long as the worst noise sources such as clock generator, data

and address buses, CRTs are avoided.

Table 21.

Lead-free process (from J-STD-020C)

Package thickness (mm)

Package reﬂow temperature (

°C)

Volume (mm3)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

MSL: Moisture Sensitivity Level

Fig 24. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

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