SA56004GD datasheet(30/36 Pages) NXP

30 / 36 page

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

30 of 36

NXP Semiconductors

SA56004X

Digital temperature sensor with overtemperature alarms

13. Packing information

The SA56004X is packed in reels, as shown in Figure 23.

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note

AN10365 “Surface mount reﬂow

soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Fig 23. Tape and reel packing method

box

barcode label

guard band

tape

reel assembly

tape detail

cover tape

carrier tape

002aad226

SA56004GD Datasheet(PDF) 30 Page - NXP Semiconductors