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PCF8563 Datasheet(PDF) 28 Page - NXP Semiconductors |
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PCF8563 Datasheet(HTML) 28 Page - NXP Semiconductors |
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28 / 32 page  PCF8563_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 21 February 2008 28 of 32 NXP Semiconductors PCF8563 Real-time clock/calendar • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 27) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 29 and 30 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 27. Table 29. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature ( °C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 30. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature ( °C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 |
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