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CC1000-RTR2 Datasheet(PDF) 52 Page - Texas Instruments |
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CC1000-RTR2 Datasheet(HTML) 52 Page - Texas Instruments |
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52 / 55 page ![]() CC1000 SWRS048A Page 52 of 55 35. Ordering Information Chipcon Part Number* TI Part Number Description Minimum Order Quantity (MOQ) CC1000-RTB1 CC1000PW Single Chip RF Transceiver. CC1000, TSSOP 28 package, RoHS compliant Pb- free assembly in tubes with 50 pcs per tube. 250 (5 tubes of 50 units per tube) CC1000-RTR1 CC1000PWR Single Chip RF Transceiver. CC1000, TSSOP 28 package, RoHS compliant Pb- free assembly, T&R with 2500 pcs per reel. 2500 (tape and reel) CC1000-RWP2 CC1000YZ Single Chip RF Transceiver. CC1000, UltraCSP™ package, RoHS compliant Pb- free assembly with 117 pcs per waffle pack. 585 (5 waffle packs with 117 pcs per waffle pack) CC1000-RTR2 CC1000YZR Single Chip RF Transceiver. CC1000, UltraCSP™ package, RoHS compliant Pb- free assembly, T&R with 2500 pcs per reel. 2500 (tape and reel) CC1000DK-433 CC1000DK-433 CC1000 Development Kit, 433 MHz 1 CC1000DK-868-915 CC1000DK-868-915 CC1000 Development Kit, 868/915 MHz 1 CC1000PPK-433 CC1000PPK-433 CC1000 Plug & Play Kit, 433 MHz 1 CC1000PPK-868 CC1000PPK-868 CC1000 Plug & Play Kit, 868/915 MHz 1 * Chipcon part numbers are obsolete, but included for reference. Use the TI part numbers when ordering parts. 36. General Information 36.1 Document Revision History Revision Date Description/Changes SWRS048A January 2007 Reflow soldering temperature according to IPC/JEDEC J-STD-020C. Max reflow temperature for CC1000 UltraCSP™ updated to 255 °C. Added waffle pack specification. Updated ordering information with TI part numbers. Updated address information. Updated header and footer. Updated Important Notice. Removed Chipcon specific Disclaimer, Trademarks and Life Support Policy sections. SWRS048 (2.3) August 2005 UltraCSP™ package included Minor corrections and editorial changes 2.2 April 2004 Shaping feature removed Application circuit simplified Additional information added for the demodulator Additional information added for frequency calculation Additional information added for calibration Additional information added for crystal oscillator Preliminary version removed Narrow band information removed REFDIV different in RX and TX Minor corrections and editorial changes 36.2 Product Status Definitions Data Sheet Identification Product Status Definition Advance Information Planned or Under Development This data sheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary Engineering Samples and First Production This data sheet contains preliminary data, and supplementary data will be published at a later date. Chipcon reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. No Identification Noted Full Production This data sheet contains the final specifications. Chipcon reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. |
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