29

3443C–DFLSH–5/05

AT45DB041B

18. Ordering Information

Note:

1. The next generation DataFlash devices will not be offered in 28-SOIC package, therefore, this package is not recommended

for new designs.

18.1

Standard Package Options

(MHz)

I

Ordering Code

Package

Operation Range

Active

Standby

20

10

0.01

AT45DB041B-CC

AT45DB041B-CNC

AT45DB041B-RC

AT45DB041B-SC

AT45DB041B-TC

14C1

8CN3

28R(1)

8S2

28T

Commercial

(0

°C to 70°C)

2.7V to 3.6V

20

10

0.01

AT45DB041B-CI

AT45DB041B-CNI

AT45DB041B-RI

AT45DB041B-SI

AT45DB041B-TI

14C1

8CN3

28R(1)

8S2

28T

Industrial

(-40

°C to 85°C)

2.7V to 3.6V

15

10

0.01

AT45DB041B-RC-2.5

AT45DB041B-CNC-2.5

AT45DB041B-SC-2.5

AT45DB041B-TC-2.5

28R

8CN3

8S2

28T

Commercial

(0

°C to 70°C)

2.5V to 3.6V

18.2

Green Package Options (Pb/Halide-free/RoHS Compliant)

f

SCK

(MHz)

Ordering Code

Package

Operation Range

Active

Standby

20

10

0.01

AT45DB041B-CU

AT45DB041B-CNU

AT45DB041B-RU

AT45DB041B-SU

AT45DB041B-TU

14C1

8CN3

28R(1)

8S2

28T

Industrial

(-40

°C to 85°C)

2.7V to 3.6V

Package Type

14C1

14-ball, 3 x 5 Array Plastic Chip-scale Ball Grid Array (CBGA)

8CN3

8-pad (6 mm x 8 mm ) Chip Array Small Outline No Lead Package (CASON

)

28R

28-lead, 0.330" Wide, Plastic Gull Wing Small Outline Package (SOIC)

8S2

8-lead, 0.210" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)

28T

28-lead, Plastic Thin Small Outline Package (TSOP)