M24512-R datasheet(29/47 Pages) STMICROELECTRONICS

29 / 47 page

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®

packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions

and product status are available at: www.st.com. ECOPACK® is an ST trademark.

For die information concerning the M24512-W delivered in unsawn wafer, please contact your nearest ST Sales

Office.

9.1

UFDFPN8 (DFN8) package information

UFDFPN8 is an 8-lead, 2 × 3 mm, 0.5 mm thickness ultra thin profile fine pitch dual flat package

Figure 15. UFDFPN8 - Outline

Top view

Pin #1

ID marking

Side view

Seating plane

eee

ccc

1 2

aaa

Datum A

Terminal tip

Detail “A”

Even terminal

e/2

Pin #1

ID marking

Bottom view

See Detail “A”

1 2

ND-1 x

Max. package war-page is 0.05 mm.

Exposed copper is not systematic and can appear partially or totally according to the cross section.

Drawing is not to scale.

The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating

(not connected) in the end application.

M24512-W M24512-R M24512-DF

Package information

DS6520 - Rev 31

page 29/47

M24512-R Datasheet(PDF) 29 Page - STMicroelectronics