M95512-RMB3TPSLASHAB datasheet(42/48 Pages) STMICROELECTRONICS

Part #	M95512-RMB3TP/AB

Description	512 Kbit serial SPI bus EEPROM with high-speed clock

PDF	48 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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42 / 48 page

Package mechanical data

M95512-W, M95512-R

42/48

Doc ID 11124 Rev 13

Figure 26.

WLCSP-R – 8-bump wafer-length chip-scale package outline

Drawing is not to scale.

Table 22.

WLCSP-R – 8-bump wafer-length chip-scale package mechanical data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

0.580

0.490

0.670

0.0228

0.0193

0.0264

0.230

0.0091

0.350

0.0138

b(2)

Measured at the maximum bump diameter parallel to primary datum Z.

0.322

0.0127

1.433

1.548

0.0564

0.0609

1.901

2.016

0.0748

0.0794

1.000

0.0394

0.866

0.0341

0.500

0.0197

0.433

0.0170

0.284

0.0112

0.453

0.0178

N (number of terminals)

aaa

0.110

0.0043

eee

0.060

0.0024

Orientation reference

Wafer back side

Side view

Detail A

Orientation reference

Bump side

aaa

Bump

Seating plane

Detail A

rotated by 90 °C

eee Z

ME_1Cc

M95512-RMB3TP/AB Datasheet(PDF) 42 Page - STMicroelectronics

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