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L99CL01XP Datasheet(PDF) 53 Page - STMicroelectronics |
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L99CL01XP Datasheet(HTML) 53 Page - STMicroelectronics |
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53 / 60 page ![]() DocID023902 Rev 4 53/60 L99CL01XP Package and PCB thermal data 5 Package and PCB thermal data 5.1 PowerSSO-36 thermal data Figure 9. PowerSSO-36 PC board Note: Board finish thickness 1.6 mm +/- 10%; Board double layer and four layers; Board dimension 129x60; Board Material FR4; Cu thickness 0.070 mm (outer layers); Cu thickness 0.035 mm (inner layers); Thermal vias separation 1.2 mm; Thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm; Footprint dimension 4.1 mm x 6.5 mm |
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