DLPC8445VAMD datasheet(22/73 Pages) TI2

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5.3 Recommended Operating Conditions (continued)

PARAMETER

TOLERANCE

MIN

TYP

MAX

UNIT

GENERAL

Operating junction temperature

–30

115

°C

Operating case temperature

–30

°C

Operating ambient temperature (1) (2)

–30

°C

(1)

The operating ambient temperature range values were determined based on the board design parameters described in the General

Layout Guidelines, rather than using a JEDEC JESD51 standard test card and environment, along with min and max estimated

power dissipation across process, voltage, and temperature. Ambient thermal conditions, which impact RθJA, vary by application.

Thus, maximum operating ambient temperature varies by application. Ta_min = Tj_min – (Pd_min x RθJA) = 0°C – (host_min_valueW x

host_value°C/W) = – host_value°C/W) = -host_calculated_value°C. Ta_max = Tj_max – (Pd_max x RθJA) = +115°C – (host_max_valueW x

host_value°C/W) = +host_calculated_value°C

(2)

Operating ambient temperature is dependent on system thermal design. Operating case temperature may not exceed its specified

range across ambient temperature conditions.

5.4 Thermal Information

THERMAL METRIC (1)

TEST CONDITIONS

FCCSP

UNIT

484 PINS

RJC

Junction-to-case thermal resistance

3.3

°C/W

RθJA

Junction-to-air thermal

resistance

at 0m/s of forced airflow(2)

19.5

°C/W

at 1m/s of forced airflow(2)

12.9

at 2m/s of forced airflow(2)

11.8

ψJT

Temperature variance from junction to package top center temperature, per unit

power dissipation

0.04

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Thermal coefficients abide by JEDEC Standard 51. RθJA is the thermal resistance of the package as measured using a JEDEC-defined

standard test PCB. This JEDEC test PCB is not necessarily representative of the controller PCB, and thus the reported thermal

resistance may not be accurate in the actual product application. Although the actual thermal resistance may be different, it is the best

information available during the design phase to estimate thermal performance.

5.5 Power Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)

PARAMETER

Test Conditions

MIN

TYP(1)

MAX

UNIT

V(Supply08)

0.8V DVH Supply

Core Supply

1.48

V(Supply18)

1.8V DVH Supply

IO Supply, VbyOne, SubLVDS, GPIO

180

V(Supply33)

3.3V DVH Supply

USB Supply

(1)

Typical power is based on standard use case 3840x2160 CVT timings with SMPTE color bar image at 25C ambient temperature. The

values do not take into account software updates or customer changes that may affect power performance.

DLPC8445, DLPC8445V, DLPC8455

DLPS253B – SEPTEMBER 2024 – REVISED AUGUST 2025

www.ti.com

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