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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard

C1070_C0G_HV_FT-CAP_SMD • 2/28/2023

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

User Direction of Unreeling

Top Cover Tape

T

Center Lines of Cavity

P1

ØDo

Po

E

1

F

E

2

W

G

A

0

B

0

Cavity Size,

See

Note 1, Table 7

Bottom Cover Tape

T1

T1

Bottom Cover Tape

(10 pitches cumulative

tolerance on tape ±0.2 mm)

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

D

0

E

1

P

0

P

2

T

1 Maximum

G Minimum

R Reference

Note 2

8 mm

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.10

(0.004)

maximum

0.75

(0.030)

25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

Pitch

E2 Minimum

F

P

1

T Maximum

W Maximum

A

0 B0

8 mm

Half (2 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

2.0 ±0.05

(0.079 ±0.002)

1.1

(0.098)

8.3

(0.327)

Note 1

8 mm

Single (4 mm)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

1. The cavity defined by A

0, B0 and T shall surround the component with sufficient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been

removed.

c) rotation of the component is limited to 20° maximum (see Figure 3.)

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)

e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6.)