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C1206X393DGGACTU Datasheet(PDF) 14 Page - Kemet Corporation |
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C1206X393DGGACTU Datasheet(HTML) 14 Page - Kemet Corporation |
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14 / 23 page ![]() 14 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1070_C0G_HV_FT-CAP_SMD • 2/28/2023 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions cont. Stress Reference Test Condition Limits Biased Humidity MIL-STD-202 Method 103 Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Moisture Resistance MIL-STD-202 Method 106 Number of Cycles Required: 10, 24 hours per cycle. Steps 7a and 7b not required Cap: Initial Limit DF: Initial Limit IR: Initial Limit Thermal Shock MIL-STD-202 Method 107 Number of Cycles Required: 5, (−55°C to 125°C) Dwell time 15 minutes. Cap: Initial Limit DF: Initial Limit IR: Initial Limit High Temperature Life MIL-STD-202 Method 108 1,000 hours at 125°C with 1.2 X rated voltage applied. Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift DF Limits Maximum: 0.5% IR: 10% of Initial Limit Storage Life 1,000 hours at 150°C, Unpowered Vibration MIL-STD-202 Method 204 5 g's for 20 minutes, 12 cycles each of 3 orientations. Test from 10 – 2,000 Hz Cap: Initial Limit DF: Initial Limit IR: Initial Limit Mechanical Shock MIL-STD-202 Method 213 1,500 g’s 0.5 millisecond Half-sine, Velocity Change: 15.4 feet/second (Condition F) Cap: Initial Limit DF: Initial Limit IR: Initial Limit Resistance to Solvents MIL-STD-202 Method 215 Add Aqueous wash chemical OKEMCLEAN (A 6% concentrated Oakite cleaner) or equivalent. Do not use banned solvents. Visual Inspection 10X Readable marking, no decoloration or stains. No physical damage. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. |
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