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SST26WF080BA Datasheet(PDF) 40 Page - Microchip Technology

Part # SST26WF080BA
Description  1.8V 4 Mbit and 8 Mbit Serial Quad I/O (SQI) Flash Memory
PDF  96 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SST26WF080BA Datasheet(HTML) 40 Page - Microchip Technology

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SST26WF040B/040BA SST26WF080B/080BA
DS20005283C-page 40
 2014-2017 Microchip Technology Inc.
5.38
Deep Power-Down
The Deep Power-down (DPD) instruction puts the
device in the lowest power consumption mode–the
Deep Power-down mode. The Deep Power-down
instruction is ignored during an internal write operation.
While the device is in Deep Power-down mode, all
instructions will be ignored except for the Release
Deep Power-down instruction.
Enter Deep Power-down mode by initiating the Deep
Power-down (DPD) instruction (B9H) while driving CE#
low. CE# must be driven high before executing the
DPD instruction. After CE# is driven high, it requires a
delay of TDPD before the standby current ISB is reduced
to deep power-down current IDPD. See Table 5-8 for
Deep Power-down timing. If the device is busy perform-
ing an internal erase or program operation, initiating a
Deep Power-down instruction will not placed the device
in Deep Power-down mode. See Figures 5-46 and 5-47
for the DPD instruction sequence.
FIGURE 5-46:
DEEP POWER-DOWN (DPD) SEQUENCE (SQI)
FIGURE 5-47:
DEEP POWER-DOWN (DPD) (SPI)
TABLE 5-8:
DEEP POWER-DOWN
Symbol
Parameter
Min
Max
Units
TDPD
CE# High to Deep Power-down
3
µs
TSBR
CE# High to Standby Mode
10
µs
20005283 F100.0
MODE 3
SCK
SIO(3:0)
CE#
MODE 0
B9
MSN
LSN
0
1
TDPD
Standby Mode Deep Power-Down Mode
Note: MSN= Most Significant Nibble; LSN = Least Significant Nibble
CE#
SO
SI
SCK
01 2 3 4 5 6 7
B9
HIGH IMPEDANCE
MODE 0
MODE 3
20005283 F101.0
MSB
TDPD
Standby Mode Deep Power-Down Mode



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