2

Pin configuration

Figure 2. Flip-Chip8 package (top through view)

D1

D0

PGOOD

VIN

SW

VOUT

EN

GND

A

B

C

D

E

1

2

3

Table 2. Pin description

Name

Bump name

Description

VIN

A3

Input supply voltage. Bypass this pin to ground with a 10 µF capacitor

SW

C3

Switching output. Inductor connection

VOUT

E3

Sense pin used to monitor output voltage

EN

B2

Enable pin. High logic level turns on the IC. VIN referred

GND

D2

Ground

D1

A1

Output voltage selection inputs (Refer to the Section 5

D0

C1

PGOOD

E1

Open drain output. It is in high impedance when the output voltage reaches 97.5% of the target VOUT

ST1PS01

Pin configuration

DS12799 - Rev 5

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