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TLV9041UIDBVR Datasheet(PDF) 9 Page - Texas Instruments

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Part # TLV9041UIDBVR
Description  TLV904x 1.2-V Ultra Low Voltage, 10關A Micro-Power RRIO Amplifier for Power Conscious Applications
PDF  67 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV9041UIDBVR Datasheet(HTML) 9 Page - Texas Instruments

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7.5 Thermal Information for Dual Channel
THERMAL METRIC (1)
TLV9042
TLV9042S
UNIT
D
(SOIC)
DDF
(SOT-23-8)
DSG
(WSON)
PW
(TSSOP)
DGK
(VSSOP)
RUG
(X2QFN)
8 PINS
8 PINS
8 PINS
8 PINS
8 PINS
10 PINS
RθJA
Junction-to-ambient thermal
resistance
148.3
203.8
99.8
203.1
196.6
196.9
°C/W
RθJC(top)
Junction-to-case (top) thermal
resistance
89.8
123.9
122.2
91.9
87.5
87.6
°C/W
RθJB
Junction-to-board thermal
resistance
91.6
121.6
66.0
133.8
118.5
117.8
°C/W
ψJT
Junction-to-top
characterization parameter
38.6
21.7
13.8
23.7
25.7
3.4
°C/W
ψJB
Junction-to-board
characterization parameter
90.9
199.6
65.9
132.1
116.8
117.6
°C/W
RθJC(bot)
Junction-to-case (bottom)
thermal resistance
n/a
n/a
41.9
n/a
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.6 Thermal Information for Quad Channel
THERMAL METRIC (1)
TLV9044, TLV9044S
UNIT
D
(SOIC)
PW
(TSSOP)
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
116.4
135.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
72.5
78.8
°C/W
RθJB
Junction-to-board thermal resistance
72.4
63.9
°C/W
ψJT
Junction-to-top characterization parameter
30.8
14.2
°C/W
ψJB
Junction-to-board characterization parameter
72
78.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
www.ti.com
TLV9041, TLV9042, TLV9044
SBOS836E – MARCH 2020 – REVISED AUGUST 2021
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: TLV9041 TLV9042 TLV9044



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