TLV9041UIDBVR datasheet(8/67 Pages) TI

8 / 67 page

7 Specifications

7.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Supply voltage, VS = (V+) – (V–)

6.0

Signal input pins

Common-mode voltage (2)

(V–) – 0.5

(V+) + 0.5

Differential voltage (2)

VS + 0.2

Current (2)

–10

Output short-circuit (3)

Continuous

Operating ambient temperature, TA

–55

150

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±3000

Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, (V+) – (V–)

1.2

5.5

Input voltage range

(V–)

(V+)

Specified temperature

–40

125

°C

7.4 Thermal Information for Single Channel

THERMAL METRIC (1)

TLV9041, TLV9041S

UNIT

DBV

(SOT-23)

DCK (2)

(SC70)

DQN (2)

(X2SON)

5 PINS

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

235.4

214.6

233.8

TBD

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

135.1

134.2

130.7

TBD

°C/W

RθJB

Junction-to-board thermal resistance

103.2

95.6

79.7

TBD

°C/W

ψJT

Junction-to-top characterization parameter

75.6

73.8

51.6

TBD

°C/W

ψJB

Junction-to-board characterization parameter

102.7

95.3

79.1

TBD

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9041.

TLV9041, TLV9042, TLV9044

SBOS836E – MARCH 2020 – REVISED AUGUST 2021

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