| Electronic Components Datasheet Search |
|
TLV9041UIDBVR Datasheet(PDF) 53 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
TLV9041UIDBVR Datasheet(HTML) 53 Page - Texas Instruments |
|
53 / 67 page ![]() www.ti.com PACKAGE OUTLINE C 8X 0.32 0.18 1.6 0.1 2X 1.5 0.9 0.1 6X 0.5 8X 0.4 0.2 0.05 0.00 0.8 MAX A 2.1 1.9 B 2.1 1.9 0.32 0.18 0.4 0.2 (0.2) TYP WSON - 0.8 mm max height DSG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218900/D 04/2020 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 4 5 8 PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED 9 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500 ALTERNATIVE TERMINAL SHAPE TYPICAL |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |