TLV9001UIDBVR datasheet(16/86 Pages) TI

16 / 86 page

TLV9001, TLV9002, TLV9004

SBOS833O – OCTOBER 2017 – REVISED APRIL 2020

www.ti.com

Product Folder Links: TLV9001 TLV9002 TLV9004

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(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

7.8 Thermal Information: TLV9004

THERMAL METRIC(1)

TLV9004

UNIT

D (SOIC)

PW (TSSOP)

RTE (WQFN)

RUC (X2QFN)

14 PINS

16 PINS

14 PINS

RθJA

Junction-to-ambient thermal

resistance

102.1

148.3

66.4

205.5

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

56.8

68.1

69.3

72.5

°C/W

RθJB

Junction-to-board thermal resistance

58.5

92.7

41.7

150.2

°C/W

ψJT

Junction-to-top characterization

parameter

20.5

16.9

5.7

3.0

°C/W

ψJB

Junction-to-board characterization

parameter

58.1

91.8

41.5

149.6

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

7.9 Thermal Information: TLV9004S

THERMAL METRIC(1)

TLV9004S

UNIT

RTE (WQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

66.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

69.3

°C/W

RθJB

Junction-to-board thermal resistance

41.7

°C/W

ψJT

Junction-to-top characterization parameter

5.7

°C/W

ψJB

Junction-to-board characterization parameter

41.5

°C/W

TLV9001UIDBVR Datasheet(PDF) 16 Page - Texas Instruments

TLV9001UIDBVR Datasheet(HTML) 16 Page - Texas Instruments

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