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TLV9001UIDBVR Datasheet(PDF) 4 Page - Texas Instruments |
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TLV9001UIDBVR Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 86 page  4 TLV9001, TLV9002, TLV9004 SBOS833O – OCTOBER 2017 – REVISED APRIL 2020 www.ti.com Product Folder Links: TLV9001 TLV9002 TLV9004 Submit Documentation Feedback Copyright © 2017–2020, Texas Instruments Incorporated Changes from Revision D (June 2018) to Revision E Page • Corrected typo in Description section .................................................................................................................................... 1 • Added TLV9001 5-pin X2SON package to Device Information table .................................................................................... 1 • Added TLV9001S 6-pin SOT-23 package to Device Information table.................................................................................. 1 • Added TLV9004 14-pin and 16-pin WQFN packages to Device Information table ............................................................... 1 • Added TLV9001 DPW (X2SON) pinout drawing to Pin Configuration and Functions section ............................................... 7 • Added TLV9001S 6-pin SOT-23 package to Pin Configuration and Functions section ......................................................... 8 • Added TLV9004 RTE pinout information to Pin Configuration and Functions section ........................................................ 11 • Added DPW (X2SON) and DRL (SOT-553) packages to Thermal Information: TLV9001 table ......................................... 15 • Added Thermal Information: TLV9001S table to Specifications section .............................................................................. 15 • Added RUG (X2QFN) package to Thermal Information: TLV9002 table ............................................................................. 15 • Added RTE (WQFN) and RUC (WQFN) packages to Thermal Information: TLV9004 table............................................... 16 Changes from Revision C (May 2018) to Revision D Page • Added shutdown text to Description section .......................................................................................................................... 1 • Added TLV9002S and TLV9004S devices to Device Information table................................................................................. 1 • Added TLV9002S 10-pin X2QFN package to Device Information table ................................................................................ 1 • Added TLV9002S DGS package pinout information to Pin Configurations and Functions section ....................................... 9 • Added Thermal Information: TLV9001 table to Specifications section................................................................................. 15 • Added Thermal Information: TLV9004 table to Specifications section................................................................................. 16 • Added shutdown section to Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 1.8 V to 5.5 V table...... 17 • Added Shutdown section ...................................................................................................................................................... 27 Changes from Revision B (March 2018) to Revision C Page • Added TLV9002 16-pin TSSOP package to Device Information table................................................................................... 1 • Added TLV9002 10-pin X2QFN package to Device Information table................................................................................... 1 • Added TLV9002S DGS package pinout drawing in Pin Configurations and Functions section........................................... 10 • Added TLV9004 pinout diagram and pin configuration table to Pin Configuration and Functions section ......................... 11 • Added TLV9004S pinout diagram and pin configuration table to Pin Configuration and Functions section ....................... 13 • Changed TLV9002 D (SOIC) junction-to-ambient thermal resistance value from 147.4°C/W to 207.9°C/W ...................... 15 • Changed TLV9002 D (SOIC) junction-to-case (top) thermal resistance from 94.3°C/W to 92.8°C/W................................. 15 • Changed TLV9002 D (SOIC) junction-to-board thermal resistance from 89.5°C/W to 129.7°C/W...................................... 15 • Changed TLV9002 D (SOIC) junction-to-top characterization parameter from 47.3°C/W to 26°C/W ................................. 15 • Changed TLV9002 D (SOIC) junction-to-board characterization parameter from 89°C/W to 127.9°C/W ........................... 15 • Added DGK (VSSOP) thermal information to Thermal Information: TLV9002 table ........................................................... 15 • Added TLV9002 PW (TSSOP) thermal information to Thermal Information: TLV9002 table .............................................. 15 • Added PW (TSSOP) thermal information to Thermal Information: TLV9002 table ............................................................. 16 Changes from Revision A (December 2017) to Revision B Page • Added package preview notes to TLV9001 packages, TLV9004 packages, and TLV9002 8-pin VSSOP package in Device Information table ........................................................................................................................................................ 1 • Added package preview notes to TLV9001, TLV9004 and TLV9002 VSSOP package pinout drawings in Pin Configuration and Functions section ..................................................................................................................................... 7 • Deleted package preview note from TLV9002 DSG (WSON) pinout drawing in Pin Configurations and Functions section. 9 |
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