TLV9001UIDBVR datasheet(15/86 Pages) TI

15 / 86 page

TLV9001, TLV9002, TLV9004

www.ti.com

SBOS833O – OCTOBER 2017 – REVISED APRIL 2020

Product Folder Links: TLV9001 TLV9002 TLV9004

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(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2)

This package option for TLV9001 is preview only.

7.4 Thermal Information: TLV9001

THERMAL METRIC(1)

TLV9001

UNIT

DBV (SOT-23)

DCK (SC70)

DPW (X2SON)

DRL (SOT-553)(2)

5 PINS

RθJA

Junction-to-ambient thermal resistance

232.9

239.6

470.0

TBD

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

153.8

148.5

211.9

TBD

°C/W

RθJB

Junction-to-board thermal resistance

100.9

82.3

334.8

TBD

°C/W

ψJT

Junction-to-top characterization parameter

77.2

54.5

29.8

TBD

°C/W

ψJB

Junction-to-board characterization parameter

100.4

81.8

333.2

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

7.5 Thermal Information: TLV9001S

THERMAL METRIC(1)

TLV9001S

UNIT

DBV (SOT-23)

DCK (SC70)

6 PINS

RθJA

Junction-to-ambient thermal resistance

232.9

215.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

153.8

146.4

°C/W

RθJB

Junction-to-board thermal resistance

100.9

72.0

°C/W

ψJT

Junction-to-top characterization parameter

77.2

55.0

°C/W

ψJB

Junction-to-board characterization parameter

100.4

71.7

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

7.6 Thermal Information: TLV9002

THERMAL METRIC(1)

TLV9002

UNIT

(SOIC)

DGK

(VSSOP)

DGS

(VSSOP)

DSG

(WSON)

(TSSOP)

DDF

(SOT-23)

8 PINS

10 PINS

8 PINS

RθJA

Junction-to-ambient

thermal resistance

207.9

201.2

169.5

103.2

200.7

183.7

°C/W

RθJC(top)

Junction-to-case (top)

thermal resistance

92.8

85.7

84.1

120.1

95.4

112.5

°C/W

RθJB

Junction-to-board thermal

resistance

129.7

122.9

113

68.8

128.6

98.2

°C/W

ψJT

Junction-to-top

characterization

parameter

21.2

15.8

14.7

27.2

18.8

°C/W

ψJB

Junction-to-board

characterization

parameter

127.9

121.4

111.6

68.5

127.2

97.6

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

7.7 Thermal Information: TLV9002S

THERMAL METRIC(1)

TLV9002S

UNIT

DGS (VSSOP)

RUG (X2QFN)

10 PINS

RθJA

Junction-to-ambient thermal resistance

169.5

194.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

84.1

90.3

°C/W

RθJB

Junction-to-board thermal resistance

113

122.2

°C/W

ψJT

Junction-to-top characterization parameter

15.8

3.5

°C/W

ψJB

Junction-to-board characterization parameter

111.6

118.8

°C/W

TLV9001UIDBVR Datasheet(PDF) 15 Page - Texas Instruments

TLV9001UIDBVR Datasheet(HTML) 15 Page - Texas Instruments

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