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TLV9001UIDBVR Datasheet(PDF) 3 Page - Texas Instruments |
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TLV9001UIDBVR Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 86 page  3 TLV9001, TLV9002, TLV9004 www.ti.com SBOS833O – OCTOBER 2017 – REVISED APRIL 2020 Product Folder Links: TLV9001 TLV9002 TLV9004 Submit Documentation Feedback Copyright © 2017–2020, Texas Instruments Incorporated Changes from Revision K (March 2019) to Revision L Page • Added SOT-23 (8) information to Device Information table ................................................................................................... 1 • Added SOT-23 DDF package to Device Comparison Table ................................................................................................. 6 • Added SOT-23 (DDF) to Pin Configuration and Functions section........................................................................................ 9 • Added DDF (SOT-23) Thermal Information: TLV9002 table ................................................................................................ 15 Changes from Revision J (January 2019) to Revision K Page • Changed TLV9002S ESD Ratings heading to include all TLV9002S packages.................................................................. 14 • Deleted preview notation from TLV9002SIRUG in Thermal Information table..................................................................... 15 Changes from Revision I (November 2018) to Revision J Page • Deleted preview notation for TLV9002SIRUGR ..................................................................................................................... 1 • Changed TLV9004 WQFN(14) package designator to X2QFN(14) package designator ...................................................... 1 • Added RUG package to Device Comparison Table .............................................................................................................. 6 • Added DGS package to Device Comparison Table .............................................................................................................. 6 • Added shutdown devices to Device Comparison Table ........................................................................................................ 6 • Changed TLV9001 DRL package pinout drawing .................................................................................................................. 7 • Changed TLV9001 DRL package pin functions ..................................................................................................................... 7 • Deleted package preview note from TLV9002SIRUGR (X2QFN) pinout drawing ............................................................... 10 • Added TLV9004IRUC Thermal Information.......................................................................................................................... 16 • Changed legend of Closed-Loop Gain vs Frequency plot ................................................................................................... 19 Changes from Revision H (October 2018) to Revision I Page • Added TLV9002SIDGS to ESD Ratings table...................................................................................................................... 14 Changes from Revision G (September 2018) to Revision H Page • Changed From: TLV9001 DCK Package To: TLV9001T DCK Package ............................................................................... 7 Changes from Revision F (August 2018) to Revision G Page • Added Device Comparison Table........................................................................................................................................... 6 • Changed pin names for all devices and all packages ............................................................................................................ 7 • Changed pin names and I/O designation on some TLV9001 pins ........................................................................................ 7 • Changed the pin number for V+ in the SOIC, TSSOP column of the Pin Functions: TLV9004 table.................................. 12 Changes from Revision E (July 2018) to Revision F Page • Added Scalabe CMOS Amplifier for Low-Cost Applications feature ...................................................................................... 1 • Deleted PREVIEW designation on TLV9002 and TLV9004 devices with the TSSOP package. .......................................... 1 • Added TLV9001U DBV (SOT-23) pinout drawing to Pin Configuration and Functions section ............................................ 7 • Added SOT-23 U Pinout to Pin Functions section ................................................................................................................ 7 |
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