12

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1081_C0G_HV_FT_AUTO_SMD • 2/29/2016

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reflow only

Recommended Reflow Soldering Profile:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,

IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s

recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture

sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

Profile Feature

Termination Finish

SnPb

100% Matte Sn

Preheat/Soak

100°C

150°C

150°C

200°C

60 – 120 seconds

60 – 120 seconds

3°C/second maximum 3°C/second maximum

183°C

217°C

60 – 150 seconds

60 – 150 seconds

235°C

260°C

Time Within 5°C of Maximum

20 seconds maximum 30 seconds maximum

Time 25°C to Peak

Temperature

6 minutes maximum

8 minutes maximum

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reflow.

Time

25° C to Peak

25

Maximum Ramp Up Rate = 3°C/sec

Maximum Ramp Down Rate = 6°C/sec