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C1070_C0G_HV_FT-CAP • 1/23/2014 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500VDC – 3000VDC (Commerical & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

8 mm, 12 mm

or 16 mm Carrier Tape

178 mm (7.00")

or

330 mm (13.00")

Anti-Static Reel

Embossed Plastic* or

Punched Paper Carrier.

Embossment or Punched Cavity

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

KEMET

®

Bar Code Label

Sprocket Holes

Table 5 – Carrier Tape Configuration – Embossed Plastic & Punched Paper (mm)

EIA Case Size

Tape Size (W)*

Pitch (P

01005 – 0402

8

2

0603 – 1210

8

4

1805 – 1808

12

4

≥ 1812

12

8

KPS 1210

12

8

KPS 1812 & 2220

16

12

Array 0508 & 0612

8

4

*Refer to Figures 1 & 2 for W and P

*Refer to Tables 6 & 7 for tolerance specifications.