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FT230XQ-R Datasheet(PDF) 37 Page - Future Technology Devices International Ltd. |
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FT230XQ-R Datasheet(HTML) 37 Page - Future Technology Devices International Ltd. |
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37 / 44 page  Copyright © Future Technology Devices International Limited 37 FT230X USB TO BASIC UART IC Version 1.4 Document No.: FT_000566 Clearance No.: FTDI# 260 9.3 QFN-16 Package Mechanical Dimensions Figure 9.3 QFN-16 Package Dimensions The FT230XQ is supplied in a RoHS compliant leadless QFN-16 package. The package is lead (Pb) free, and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.65mm pitch. The above mechanical drawing shows the QFN-16 package. All dimensions are in millimetres. The centre pad on the base of the FT230XQ is internally connected to ground. . |
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