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FT230XQ-R Datasheet(PDF) 35 Page - Future Technology Devices International Ltd. |
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FT230XQ-R Datasheet(HTML) 35 Page - Future Technology Devices International Ltd. |
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35 / 44 page  Copyright © Future Technology Devices International Limited 35 FT230X USB TO BASIC UART IC Version 1.4 Document No.: FT_000566 Clearance No.: FTDI# 260 9 Package Parameters The FT230X is available in two different packages. The FT230XS is the SSOP-16 option and the FT230XQ is the QFN-16 package option. The solder reflow profile for both packages is described in Section 9.4. 9.1 SSOP-16 Package Mechanical Dimensions Figure 9.1 SSOP-16 Package Dimensions The FT230XS is supplied in a RoHS compliant 16 pin SSOP package. The package is lead (Pb) free and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 4.90mm x 3.91mm body (4.90mm x 5.99mm including pins). The pins are on a 0.635 mm pitch. The above mechanical drawing shows the SSOP-16 package. |
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