FT121Q-R datasheet(42/46 Pages) FTDI

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Document No.: FT_000648

FT121 ENHANCED USB DEVICE CONTROLLER WITH SPI SLAVE IC

Datasheet Version 1.2

Clearance No.: FTDI#

312

The recommended values for the solder reflow profile are detailed in Table 9.2. Values are shown for both

a completely Pb free solder process (i.e. the FT121 is used with Pb free solder), and for a non-Pb free

solder process (i.e. the FT121 is used with non-Pb free solder).

Profile Feature

Pb Free Solder

Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical

Temperature TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak

Temperature (tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature,

8 minutes Max.

6 minutes Max.

Table 9.2 Reflow Profile Parameter Values

FT121Q-R Datasheet(PDF) 42 Page - Future Technology Devices International Ltd.

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