AC0805FRE0797R6 datasheet(6/7 Pages) YAGEO

6 / 7 page

Chip Resistor Surface Mount

www.yageo.com

Mar. 14, 2016 V.0

Product specification

SERIES

0402 to 1206

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

Solderability

- Wetting

AEC-Q200 Test 18

J-STD-002

Electrical Test not required Magnification 50X

SMD conditions:

(a) Method B, aging 4 hours at 155 °C dry heat,

dipping at 235± 3 °C for 5± 0.5 seconds.

(b) Method B, steam aging 8 hours, dipping at

215± 3 °C for 5± 0.5 seconds.

260± 3 °C for 30± 0.5 seconds.

Well tinned (≥95% covered)

No visible damage

Board Flex

AEC-Q200 Test 21

AEC-Q200-005

Chips mounted on a 90mm glass epoxy resin

PCB (FR4)

Bending for 0402: 5 mm

0603/0805: 3 mm

1206 and above: 2 mm

Holding time: minimum 60 seconds

± (1.0%+0.05Ω)

Temperature

Coefficient of

Resistance (T.C.R.)

MIL-STD-202 Method 304

At +25/–55 °C and +25/+125 °C

Refer to table 2

Formula:

T.C.R=

)

× 106 (ppm/°C)

Where

t1=+25 °C or specified room temperature

t2=–55 °C or +125 °C test temperature

R1=resistance at reference temperature in ohms

R2=resistance at test temperature in ohms

Short Time

Overload

IEC60115-1 4.13

2.5 times of rated voltage or maximum

overload voltage whichever is less for 5 sec

at room temperature

± (1.0%+0.05Ω)

FOS

ASTM-B-809-95

Sulfur (saturated vapor) 500 hours, 60± 2℃,

unpowered

± ( 1.0%+0.05Ω)

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