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WINCS02IC Datasheet(PDF) 60 Page - Microchip Technology |
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WINCS02IC Datasheet(HTML) 60 Page - Microchip Technology |
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60 / 73 page ![]() WINCS02IC and WINCS02 Family Packaging Information Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 60 RECOMMENDED LAND PATTERN 28-Lead PCB Module (TEC) - 14.73x21.72x2.1 mm Body [MODULE] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: With Metal Shield and Coaxial Connector © 2024 Microchip Technology Inc. R Notes: Keep these areas free from routes and exposed copper. Ground fill with solder mask may be placed here. 2. All dimensions are in millimeters. 1. Microchip Technology Drawing C04-23567 Rev C COPPER KEEPOUT ZONE 10 11 12 13 14 15 16 17 18 19 9 8 7 6 3 4 5 2 1 21 22 23 24 25 26 27 28 28x 0.80 SILKSCREEN PCB EDGE Ø2.80 9.67 5.992 1.016 6.27 6.882 20 28X 1.90 2.667 2.667 2.032 3.70 3.70 1.905 3.68 0.216 14.73 21.72 6.861 4.064 |
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