WINCS02IC datasheet(53/73 Pages) MICROCHIP

53 / 73 page

WINCS02IC and WINCS02 Family

Packaging Information

Data Sheet

DS70005577B - 53

Packaging Information

This chapter provides information on package markings, dimension and footprint of the WINCS02IC

and the WINCS02 Module.

4.1

WINCS02IC Packaging Information

For the most current package drawings, see the Microchip Packaging Specification available at

www.microchip.com/en-us/support/package-drawings.

4.1.1

WINCS02IC Package Marking

Figure 4-1. WINCS02IC Package Marking

48L VQFN 7x7x0.9 mm

Example

Legend: XX...X Customer-specific information

Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week '01')

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

4.1.2

WINCS02IC Packaging Dimension

This section provides the package dimension details of WINCS02IC.

WINCS02IC Datasheet(PDF) 53 Page - Microchip Technology