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TLV9001UIDBVR Datasheet(PDF) 97 Page - Texas Instruments |
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TLV9001UIDBVR Datasheet(HTML) 97 Page - Texas Instruments |
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97 / 109 page  www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 8X (0.25) (1.6) (1.9) 6X (0.5) (0.9) ( 0.2) VIA TYP (0.55) 8X (0.5) (R0.05) TYP WSON - 0.8 mm max height DSG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218900/E 08/2022 SYMM 1 4 5 8 LAND PATTERN EXAMPLE SCALE:20X SYMM 9 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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