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TLV9001UIDBVR Datasheet(PDF) 37 Page - Texas Instruments |
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TLV9001UIDBVR Datasheet(HTML) 37 Page - Texas Instruments |
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37 / 109 page ![]() www.ti.com PACKAGE OUTLINE C 0.33 MAX 0.125 0.075 0.7 TYP 0.7 TYP 0.35 TYP 0.35 TYP 9X 0.195 0.155 B E A D 4226891/A 06/2021 D: Max = 1.01 mm, Min = 0.97 mm DSBGA - 0.33 mm max height YCK0009-C01 DIE SIZE BALL GRID ARRAY E: Max = 1.01 mm, Min = 0.97 mm NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C A 2 3 0.015 C A B SYMM SYMM B C 1 SCALE 12.000 www.ti.com TLV9001, TLV9002, TLV9004 SBOS833R – OCTOBER 2017 – REVISED NOVEMBER 2021 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 37 Product Folder Links: TLV9001 TLV9002 TLV9004 |
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