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TLV9001UIDBVR Datasheet(PDF) 38 Page - Texas Instruments |
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TLV9001UIDBVR Datasheet(HTML) 38 Page - Texas Instruments |
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38 / 109 page  www.ti.com EXAMPLE BOARD LAYOUT 0.0375 MIN 0.0375 MAX 9X ( 0.18) (0.35) TYP (0.35) TYP ( 0.18) SOLDER MASK OPENING ( 0.18) METAL 4226891/A 06/2021 DSBGA - 0.33 mm max height YCK0009-C01 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM C 1 2 3 A B EXPOSED METAL SHOWN LAND PATTERN EXAMPLE SCALE: 50X NON-SOLDER MASK DEFINED EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK EXPOSED METAL TLV9001, TLV9002, TLV9004 SBOS833R – OCTOBER 2017 – REVISED NOVEMBER 2021 www.ti.com 38 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TLV9001 TLV9002 TLV9004 |
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