CC2400-RTR1 datasheet(77/83 Pages) TI

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CC2400-RTR1 Datasheet(PDF) 77 Page - Texas Instruments

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77 / 83 page

CC2400

SWRS042A

Page 77 of 83

51 Recommended layout for package (QFN48)

Note: The figure is an illustration only and not to scale. There are nine 14 mil diameter via

holes distributed symmetrically in the ground pad under the package. See also the

CC2400EM reference design.

52 Package Thermal Properties

Thermal resistance

Air velocity [m/s]

Rth,j-a [K/W]

25.6

53 Soldering Information

Recommended soldering profile for both standard leaded packages and Pb-free packages is

according to IPC/JEDEC J-STD-020B, July 2002.

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